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Next-Generation Technology Designed To Meet
Advanced Process Applications For Cu Post-CMP Cleaning
The ITW Rippey Microclean F2
PVA product line has been designed to meet the ever-increasing industry
needs for cleanliness requirements in advanced semiconductor device
manufacturing processes. The fabrication of integrated circuits utilizing
low-K and copper technology requires materials specifically designed to
meet critical cleaning requirements in the removal of films and
particulates to the sub 0.10 micron level. This next-generation PVA
material is compatible with the industry standard chemistries utilized in
these manufacturing operations and provides semiconductor chip makers
with the ability to further the advancement of microprocessor performance
levels.
ITW Rippey Microclean F2 PVA products are
manufactured at the companys California facility utilizing
state-of-the-art manufacturing technologies with computer controlled
processes for environmental, contamination and process control. The
entire manufacturing process is ISO 9001:2000 certified with all
materials utilized in the formulation and production adhering to strict
specifications to ensure consistency on a volume production scale.
ITW Rippey Microclean F2 PVA products are
manufactured using a unique formulation and process that results in
optimized physical properties of the final material. These properties
include an advanced open cell structure that reduces microscratching
and decreases brush loading effects.
F2s advanced physical properties provide manufacturers the potential to
increase PVA brush lifetime on their cleaning tools and the ability to
optimize chemistry formulations to improve their critical cleaning
processes.
If you have questions regarding ITW Rippey Microclean
F2, please contact our customer service department at 916.939.4332
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